A tantárgyleírás hatályossága
Hatályosság kezdete:
2026. March 21.
Hatályosság vége:
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| Subject name (Hungarian, English) |
Mikroelektronika
Microelectronics
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| Subject code | BMEVIEEAB00 | ||||||||||||
| Subject type | — | ||||||||||||
| Training Level | — | ||||||||||||
| Course types and hours (weekly/semester) |
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| Assessment type | vizsga | ||||||||||||
| Credits | 5 | ||||||||||||
| Subject coordinator |
DR. Poppe András
position: egyetemi tanár
contact:
poppe.andras@vik.bme.hu
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| Responsible department |
Elektronikus Eszközök Tanszéke
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| Faculty | Villamosmérnöki és Informatikai Kar | ||||||||||||
| Subject website | — | ||||||||||||
| Primary curriculum type | — | ||||||||||||
| Direct prerequisites – Strong prerequisite | none | ||||||||||||
| Direct prerequisites – Weak prerequisite | none | ||||||||||||
| Direct prerequisites – Parallel prerequisite | none | ||||||||||||
| Direct prerequisites – Milestone prerequisite | none | ||||||||||||
| Direct prerequisites – Exclusion | none |
Objectives
Programme
Week 1 Review of microelectronics as one of the fastest evolving industry. The Moore’s law, international technology roadmap, barriers of evolution. Characteristics of micorelectronics manufacturing technology: deposition, doping, patterning (photolitography, etching). The concept of layout and mask. The concept of clean room. How does an IC fab look like? Basics of semiconductor physics: energy bands, charge carriers in intrinsic and doped semiconductors, generation and recombination. Currents in semiconductors, temperature dependency.
Week 2 The diode as the most simple semiconductor device. Electrostatic conditions in the pn junction, depleted region. Forward characteristics of the pn junction. Generation and recombination current, high current density phenomena. Concept of small signal operation, differential resistance of the pn junction.
Week 3 Space charge and diffusion capacitance. Reverse recovery. Modelling of diodes for circuit simulations (SPICE): model topology, model equations, model parameters. Small and high current diodes, LEDs, organic LEDs, non-electrical parameters of LEDs. Photodiodes and solar cells. Temperature dependency of pn junction.
Week 4 Structure and operation of bipolar transistor, efficiency, large signal current amplification factors. Considering secondary effects. Modelling for SPICE like circuit simulators. Small signal models. Discrete and integrated bipolar transistors. Role of bipolar transistors in todays integrated circuits (e.g. BiCMOS circuits).
Week 5 Process steps and mask sets of an IC fabrication, inventory of the realizable circuit components. Rules of creating identical components. Case study: layout of an operation amplifier. Circuit symmetry and thermal effects. Significance of electro-thermal circuit simulation.
Week 6 Types of field effect transistors: JFET, MOSFETs. Physical principles and fundamentals of unipolar operation. Family of field effect transistors.
Week 7 Properties of the MOS structure. Accumulation, depletion, inversion, threshold voltage. Characteristics of the MOST transistor. Minimal feature size. Deviation from the quadratic characteristics. Sub-threshold voltage. Capacities. SPICE simulation model of MOS transistors (topology, parameters). Process steps of the simplest MOS fabrication process, mask sets.
Week 8 Digital nMOS gates (circuit, layout). Concept of dual circuit, digital CMOS gates. Timing parameters, loading capacitances, properties of IC wirings: multi-layer metallization structures. Structure and properties of the CMOS inverter (signal propagation, consumption, sub-threshold current). CMOS gates, flip-flops. Power consumption, overheating of digital CMOS circuits and their investigation.
Dynamic MOS circuits, transfer gates. Rail drivers, tri-state drivers. Input-output circuits and their protection. Standard cells. Design process of digital circuits through a standard cell design example.
Week 9 Methods of IC design, concepts of the design flow. Design of large units in HDL (VHDL, Verilog, SystemC), concept of software/hardware co-design. IC design suites. System level design, floorplaning.
Week 10 Concept of the IP. Ordering from IP and layout agencies. Cooperation of design teams. Embedded systems. Role of the simulation in the development from the cell to the system level. Types and roles of simulation programs (circuits, logical, RTL, behavioral, physical). Different cost factors of IC design and fabrication. Choosing the optimal realization method. MPW fabrication: IC fabrication as a service (fabless design).
Week 11 Testing of VLSI circuits. Design for testability. Concept of test mode and scan path. Built in self test and its circuitry. Boundary scan method. Generating test sequences in the design process.
Week 12 Semiconductor memories. Structure of a DRAM cell. Structure and operation of ROM, EPROM and EEPROM memories. CMOS static RAM.
Week 13 Packaging of VLSI ICs. Modern (More than Moore) technics: stacked chips, 3D packaging. Chip on board, system in package. Thermal characteristics and measurement of packaged semiconductor devices (thermal resistance, thermal capacitance), description of the heat flow path by structure function.
Week 14 Non-electrical components on an IC substrate: integrated microsystems. Typical structures: cantilever, bridge, membrane. Capacitive sensing and moving. Piezo resistive sensing. Application fields. Temperature-, pressure-, acceleration- and gas sensors. Combined micromechanical-optical systems. Smart sensors, sensor networks. Outlook: what does the future holds? What is nanoelectronics?
Week 15
The subject includes laboratory practices (2 hour/week).
The aim of the laboratory exercises is to transfer the practical knowledge of applied computer aided design and verification methods in microelectronics by solving specific tasks. These tasks are the followings:
• Familiarizing with the clean room and with the manufacturing processes
• Measurement of semiconductor materials, needle measurement, capacitive measurement, pn junction
• SPICE circuit simulation based on their schematic, determination of main operational properties through simulations
• Thermal simulation of electronic systems, circuits, IC substrates: layout design, determination of the effect of the packaging and different cooling solutions
• Design of a complex digitals circuit in HDL, verification, synthesis and implementation in a real FPGA environment
• Simple circuit measurement exercise (e.g. investigation of the effect of temperature increase)
The basic goal of the course
is to deepen the already acquired knowledge in the field of digital electronics
through presenting the latest implementation techniques of digital integrated
circuits. Further goals of the subject is to provide information on the basics
of analogue integrated circuits, components of power electronics and
solid-state lightning.
Today’s electronics and IT
devices are all based on different special discrete semiconductors and complex
integrated circuits. Solid knowledge regarding the structure, operation and
manufacturing of these devices is among the necessary skills of today’s
electrical engineers including basics of IC design at least on the level, which
allows effective communication with IC design specialists. They have to know
how system level design connects with the IC design as well.
Special emphasis is put on
the corresponding practical skills through simple case studies (calculation
examples) as well as computer laboratory practices where the students are
acquainted with the basic steps IC design.
An important aspect of the course is to bridge
the gap between the operation of abstract electronics components and the
physical reality: the major components used in ICs (diodes, transistors, etc.)
are discussed in detail. A detour is made towards the MEMS and MOEMS, where
electrical operation is combined with mechanical and optical effects.
Learning outcomes
Ez a tantárgy a KKK rendeletben meghatározott, következő kompetenciák fejlesztését szolgálja:
Knowledge
No learning outcomes recorded.
Skills
No learning outcomes recorded.
Attitudes
No learning outcomes recorded.
Autonomy and responsibility
No learning outcomes recorded.
Oktatási módszertan
The theory of the subject is lectured in 3
hours/week. The presentation materials is continuously illustrated by showing
images of microelectronical structures (microscopic, electro-microscopic), on
the fly measurements and modells.
Some characteristics calculation tasks are
illustrated by examples during the class. The design and simulation practices
are held in computer labs. During these sessions, the students need to solve
individual tasks.
The lab exercises are mandatory. The presence is
verified every time. Two recaps are available.
Tanulástámogató anyagok
Online források
· ; Székely V.: Elektronika I.; Félvezető eszközök, Műegyetemi Kiadó, 55054; S. M. Sze - Physics of; Semiconductor Devices, Wiley-Interscience, 1969; Adel S. Sedra, Kenneth C.; Smith - Microelectronic circuits, Oxford University Press 2004; Dr. Mojzes Imre (szerk.):; Mikroelektronika és elektronikai technológia (2. kiadás); Downloadable electronics; slideshow
Recommended preliminary knowledge for completing the subject
Knowledge type competencies
(azon előzetes ismeretek összessége, amelyek megléte nem kötelező, de a tantárgy eredményes teljesítését nagyban elősegíti)
Electronics 1,
Digital technics 1, Digital technics 2, Phisics 2, Elektronika 1, Digitális
technika 1, Digitális technika 2, Fizika 2, Electronics Technology and
Materials
Skill type competencies
(azon előzetes képességek és készségek összessége, amelyek megléte nem kötelező, de a tantárgy eredményes teljesítését nagyban elősegíti)
nincs
Recommended (non-compulsory) preliminary competencies
(azon ajánlott (nem kötelező) előzetesen megszerzendő kompetenciák összessége, amelyek jelentősen hozzájárulnak a tantárgy eredményes teljesítéséhez)
Electronics 1,
Digital technics 1, Digital technics 2, Phisics 2, Elektronika 1, Digitális
technika 1, Digitális technika 2, Fizika 2, Electronics Technology and
Materials
General rules
Requirements:
In the lecturing period, the conditions of the
signature and Semester mark are the following:
Accomplishment
of the laboratory practices (this is controlled in each occasion, each
task has to be accomplished at least on fair level.
Achieving
minimum fair level at one of the tests
In the exam
period:
·
Achieving minimum fair level in
the written exam.
Additional possibilities:
Two
laboratory practice can be repeated on the repetition occasion during the
Semester. The mid-term can be repeated once during the study period and once in
the retake period. If the mandatory presence requirement during classroom and
computer room practices was satisfied and the student also completed the
requirements for the small tests.
Assessment methods
In-term assessments
No detailed assessments provided.
Weight of in-term assessments
No weights provided.
Exam-period assessments
No detailed assessments provided.
Weight of exam elements
No weights provided.
Grade calculation
No grade thresholds provided.
Attendance requirements
No attendance requirements provided.
Rules for retake and resubmission
Not provided.
Short description
Not provided.
Detailed description
Not provided.
Recommended courses
Recommended: Signature in Electronics I.
Workload to complete the subject
No workload breakdown provided.
Validity of subject requirements
Requirements valid from:
—
Requirements valid until:
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Curriculum placement
No curriculum placements recorded for this subject version.