Microelectronics and Microsystems

Implementation of transistors, resistors, capacitors, etc with bipolar and MOS technologies. Their parameters, electrical qualities depending on the technology used. Technology and device construction contexts. Device modeling questions. New issues raised by the implementation of submicron devices. Electromigration.

The definition of micro-systems. the impact of scale down to the characteristics of the (micro) systems. Deriving and the role in micro-technology of the characteristic distances and times. Advanced technological processes for the realization of micro(mechanical) systems to: to achieve great height / width ratio. Surface and bulk processing techniques: layer deposition and machining, isotropic and anisotropic etching techniques, dry etching (plasma etching), wet chemical etching processes, electrochemical processes, etching selectivity. Wafer bonding. Sacrificial layer technique. IC production compatible methods. The LIGA process. Standard MEMS Technologies: MUMPS, SUMMiT V, TDSI MIDIS, AMS Bulk Micromachining etc.

Basics of mechanics of materials: tension, strain, Hooke's law. shear stress. Tensor theory of mechanics of materials. The stress tensor and strain tensor. Tensorial elastic modulus. The case of silicon. The bent rod. The second order torque. Tthe dependence of the radius of curvature from torque. The screw rod. The deformation of the loaded console. The calculation of the spring constant. The both ends clamped spring permissiveness. Mechanical resonance frequency calculation of a console (bending mode). Concentrated parametric approach. Differential equation of the distributed parameter problem.

Mechanical sensors: accelerometer unit. Construction, operation. Sensitivity calculation. Sensing methods that can be used in accelerometers. Pressure micro-sensors (absolute and relative), membrane technologies.

The electro-thermal transport equations. Seebeck, Peltier and Thomson effects. Temperature sensors: termoresistor, pn diode sensor, bipolar transistor sensor. The PTAT principle. MOS transistor sensor. Temperature gradient sensing by thermocouple.

Thermal radiation-based infrared detector. The sensitivity calculation (equivalent input noise level). Thermal authoritarian rms meter. Flow rate and direction sensing by thermal principle.

Other micro-sensors: electric, magnetic, radiation and chemical sensors.

Actuators: light modulation by rotating micromirror. The calculation of the torque of electrostatic movement. Torque-rotation diagrams, possible stable states. Electrostatic micro-motors and other drive mechanisms.

Fundamentals of fluid mechanics, microfluidics, Lab-on-Chip systems. Pneumatic micro systems: air reinforcing beam writing. Micro cooling systems.

Typical measurement methods that are used for measuring electrical, optical, micro-mechanical properties of the used materials and structures (electron microscopy, micro-analysis, based on X-ray and micro-mechanical scanning method, infrared thermography, thermal transient testing, photonic devices (LEDs) combined optical, electrical, thermal testing)
 

Design, implementation and testing issues of complex micro systems with electrical, mechanical and optical elements. The automated design tools: physical simulators. Modelling (ROM, compact modeling, distributed and concentrated models); high-level language description of attached multi-domain systems.