Subject » BMEVIEEMA02
Design of Microelectronics System
Mikroelektronikai rendszerek tervezése
A tantárgyleírás hatályossága
Hatályosság kezdete:
2026. March 21.
Hatályosság vége:
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| Subject name (Hungarian, English) |
Mikroelektronikai rendszerek tervezése
Design of Microelectronics System
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| Subject code | BMEVIEEMA02 | ||||||||||||
| Subject type | — | ||||||||||||
| Training Level | — | ||||||||||||
| Course types and hours (weekly/semester) |
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| Assessment type | vizsga | ||||||||||||
| Credits | 4 | ||||||||||||
| Subject coordinator |
DR. Bognár György
position: egyetemi docens
contact:
bognar.gyorgy@vik.bme.hu
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| Responsible department |
Elektronikus Eszközök Tanszéke
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| Faculty | Villamosmérnöki és Informatikai Kar | ||||||||||||
| Subject website | — | ||||||||||||
| Primary curriculum type | — | ||||||||||||
| Direct prerequisites – Strong prerequisite | none | ||||||||||||
| Direct prerequisites – Weak prerequisite | none | ||||||||||||
| Direct prerequisites – Parallel prerequisite | none | ||||||||||||
| Direct prerequisites – Milestone prerequisite | none | ||||||||||||
| Direct prerequisites – Exclusion | none |
Objectives
Programme
Syllabus of lectures:
- Introduction into the mixed-signal, very large scale integrated systems, development trends, ITRS roadmap, Smart System devices.
- Build-up and design methodology of System-on-chip (SoC) VLSI systems, detailed SoC design flow
- More than Moore integration, 3D IC technology, stacked die structures, System-on-Chip, System-in-Package, design methodology and technology of 3D IC integration
- The effect of scale-down, physical and technology limits, new solutions applied in modern CMOS technologies (gate engineering, high K, low K, strained silicon, multi VT technique, electro-migration, tri-gate&FinFET transistors) from the point of view of the designer
- Design methodology of low-power systems, the possibility reduction of the power consumption, typical low-power circuits and techniques. Typical feature of high and radio frequency integrated circuits’ structures. The design methodology of RF circuits, problems of modelling. Realization of inductivity on the semiconductor surface.
- Case study – introduction and analysis of typical LSI circuit from the field of telecommunications: architecture of typical transceiver circuits and frequency dividers. Design methodology of pulse swallower and phase changing frequency dividers. Packaging of RF circuits.
- Design and analysis of typical analogue integrated circuits applied in telecommunications, sensor read-out circuitries and signal processing: amplifiers, A/D and D/A converters, etc.)
- Design and analysis of typical analogue circuits: differential pair, current mirror, OTA, opamp
- Design methodology and practical skills of analogue / mixed-signal layout.
- Physical effect taken into account during design (e.g.: thermal, high frequency, etc.). Thermal aware design: thermal influences in the layout design.
- Electro-thermal, logi-thermal and cell-thermal simulation tools, comparison, operation principles, case studies
- The elements of a modern IC design framework on a defined IC process technology. The phenomena of Process Design Kit (PDK)
- Extension of classical IC PDK to MEMS design. The applied CAD/CAM tools in the MEMS design flow. MEMS Design strategies. Introduction of application specific design methodologies. Case studies.
- Coupled physical modelling issues, analysis of multidomain (e.g.: the circuit models for each analogue systems, reduced order model and its relationship with the system-level behavioral descriptions, multi-physics simulations), investigation of energy conversion processes.
- Computational modelling and simulation of MES structures, finite element method, reduced order model / network model. Overview of simulation tools. Introducing the design and simulation tools of MEMS
- Getting acquainted with the IC design framework system, introduction to the design flow, case study. Getting the specification
- Design and simulation of the schematic of the selected circuit (DC, AC, transient)
- Investigation of the circuit operation in addition to the process scattering and ambient temperature changes. Redesign of the circuit.
- Design steps and flow of the MEMS device. The physical design of a selected MEMS structure
- Simulation of the operation of the MEMS structure by FEM simulation tools.
- Co-design and co-simulation possibilities and method of System on chip devices.
In the frame of the Design of Microelectronics System course the special methodologies and tools during the design of analogue, mixed-signal integrated circuits and Micro Electro Mechanical Systems (MEMS) will be introduced. The aim of the course to give knowledge and practical skills about modern integrated circuits and MEMS structures, System-on-Chip (SoC) and System-in-Package (SiP) devices, design methodology of integrated circuits applied in cyberphysical-systems, computer aided IC design (CAD) tools, the principal components, the complete design and verification flow and the future trends. The 2nd order effects (e.g.: thermal influences) will be discussed also.
Learning outcomes
Ez a tantárgy a KKK rendeletben meghatározott, következő kompetenciák fejlesztését szolgálja:
Knowledge
No learning outcomes recorded.
Skills
No learning outcomes recorded.
Attitudes
No learning outcomes recorded.
Autonomy and responsibility
No learning outcomes recorded.
Oktatási módszertan
2
hours/week lectures and 1 hour/week (computer) laboratory practices including
demonstration with practical examples and case studies.
Tanulástámogató anyagok
Online források
- ; Wai-Kai; Chen , ”The VLSI handbook”, CRC Press LLC, 2000. ISBN 0-8493-8593-8; Mohamed; Gad-el-Hak, ”MEMS Design and Fabrication”, CRC Press LLC, 2006. ISBN; 0-8493-9138-5; Stephen D.; Senturia, „Microsystem design” Kluwer Academic Publishers. 2002. ISBN; 0-7923-7246-8; Journal papers:; o ; IEEE Solid; State Technology, IEEE VLSI Circuits (http://ieeexplore.ieee.org); European; Semiconductors
Recommended preliminary knowledge for completing the subject
Knowledge type competencies
(azon előzetes ismeretek összessége, amelyek megléte nem kötelező, de a tantárgy eredményes teljesítését nagyban elősegíti)
Electronics
Skill type competencies
(azon előzetes képességek és készségek összessége, amelyek megléte nem kötelező, de a tantárgy eredményes teljesítését nagyban elősegíti)
nincs
Recommended (non-compulsory) preliminary competencies
(azon ajánlott (nem kötelező) előzetesen megszerzendő kompetenciák összessége, amelyek jelentősen hozzájárulnak a tantárgy eredményes teljesítéséhez)
Electronics
General rules
Requirements:
a. During the term: one mid-term test
Requirement
for granting the signature: >= 2 (satisfactory).
The
signature is valid for the next semester, too.
b. In the exam period:
Way of
examination: written and oral
c. Exam before the examination period:
Possible if the midterm grade >= 4
Additional possibilities:
On mid-term
test
If a
student fails to turn up at mid-term test, it can be repeated during the term.
Failed mid-term
test can be repeated in the repeat period only once.
Assessment methods
In-term assessments
No detailed assessments provided.
Weight of in-term assessments
No weights provided.
Exam-period assessments
No detailed assessments provided.
Weight of exam elements
No weights provided.
Grade calculation
No grade thresholds provided.
Attendance requirements
No attendance requirements provided.
Rules for retake and resubmission
Not provided.
Short description
Not provided.
Detailed description
Not provided.
Recommended courses
-
Workload to complete the subject
No workload breakdown provided.
Validity of subject requirements
Requirements valid from:
—
Requirements valid until:
—
Curriculum placement
No curriculum placements recorded for this subject version.