Subject » BMEVIEEMA06
Circuit Environment
Áramköri környezet kialakítása
A tantárgyleírás hatályossága
Hatályosság kezdete:
2026. March 21.
Hatályosság vége:
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| Subject name (Hungarian, English) |
Áramköri környezet kialakítása
Circuit Environment
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|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Subject code | BMEVIEEMA06 | ||||||||||||
| Subject type | — | ||||||||||||
| Training Level | — | ||||||||||||
| Course types and hours (weekly/semester) |
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| Assessment type | vizsga | ||||||||||||
| Credits | 4 | ||||||||||||
| Subject coordinator |
DR. Takács Gábor
position: egyetemi docens
contact:
takacs.gabor@vik.bme.hu
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| Responsible department |
Elektronikus Eszközök Tanszéke
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| Faculty | Villamosmérnöki és Informatikai Kar | ||||||||||||
| Subject website | — | ||||||||||||
| Primary curriculum type | — | ||||||||||||
| Direct prerequisites – Strong prerequisite | none | ||||||||||||
| Direct prerequisites – Weak prerequisite | none | ||||||||||||
| Direct prerequisites – Parallel prerequisite | none | ||||||||||||
| Direct prerequisites – Milestone prerequisite | none | ||||||||||||
| Direct prerequisites – Exclusion | none |
Objectives
Programme
Syllabus of the lectures
1. The phenomena of circuit environment, borders of the circuit environment, the design steps and implementation issues of SiP, SoP, MCM, 3D stacked ICs devices, TSV.
2. Modern packaging solutions. Fann-ot, WLP, intermediate enclosures with buried silicon layers (EMIBB). Relationship of IC design and enclosure from the design perspective.
3. Investigation of parasitic effects of packaging on the basis of Radio Frequency, thermal and other physical influences: IBIS model, Delphi model, 2R model
4. Development of circuit environment influenced by thermal effects. Active and passive cooling methods, build-up and characterization of microscale cooling devices.
5. Thermal analysis of equipments working in harsh environment (rack drawers, IoT devices in harsh environment, etc.)
6. Thermal transient testing methodology, multi-domain characterization of LED devices, characterization of thermal interface materials (TIM)
7. Introduction of a whole process development flow: the basic steps of the development, test methods, management issues. Reliability investigations, the effects of the ambient to the operation of the circuit.
8. Design flow of electrical equipment from the specification to the realization. Top-down and bottom-up methodology applied in the development flow of the circuit environment (PCW, connections, enclosures, etc.)
9. Specification and documentation issues of the circuit environment.
10. Introduction to signal integrity: plane capacitance, losses, delays, skin effect and proximity effect, wave impedance and passive devices in real parasitic elements.
11. Reflections, terminations of transmission lines: under and overdriven lines, series and parallel R, RC terminations, Thevenin termination, junction
12. Case study: pre-layout signal integrity simulation
13. Cross-talk, differential and common mode signals and impedances, signal propagation
14. Thermal management with industrial CAD tools (Mentor Graphics© FloTHERM)
Syllabus of the laboratory practises:
1. Getting acquainted to a PCW design environment and its build-up
2. Schematic capture
3. The usage and the settings of constraint editor system
4. Design of the layout
5. Thermal simulation
6. pre- and post-layout signal integrity simulations
7. Thermal analysis of packages (Mentor Graphics© FloTHERM® PACK).
The scope of the subject is to get the students acquainted with the development of the packaged intelligent devices operating environment, the design software, the modern simulation tools. Deals with the design, testing, simulation steps and gives practical knowledge on their industrial applications. Introduce the theoretical background of the simulations and physical phenomenon.
Learning outcomes
Ez a tantárgy a KKK rendeletben meghatározott, következő kompetenciák fejlesztését szolgálja:
Knowledge
No learning outcomes recorded.
Skills
No learning outcomes recorded.
Attitudes
No learning outcomes recorded.
Autonomy and responsibility
No learning outcomes recorded.
Oktatási módszertan
2
hours/week lectures and 1 hour/week (computer) laboratory practices including
demonstration with practical examples and case studies.
Tanulástámogató anyagok
Online források
- Clyde F. Coombs: „Printed Circuits Handbook, 6th edition”, McGraw-Hill, USA, 2008; - Eric Bogatin: „Signal Integrity – Simplified”, Prentice Hall, USA, 2004; - ; Stephen H. Hall, Garrett W. Hall, James A. McCall: „High- Speed Digital; System – A Handbook of Interconnect Theory and Design Practice”, John; Wiley & Sons, Inc. USA, 2000; - Horward Johnson, Martin; Graham: „High-Speed Digital Design – A Handbook of Black Magic, Prentice; Hall”, New Jersey, USA, 1993; - Mentor Graphics - Printed; Circuit Board Design Course Laboratory Instruction: „Pre-Layout; Analysis with HyperLynx”, Politechnika Śląska w Gliwicach, Instytut; Elektroniki, Zakład Podstaw Elektroniki; - Mentor Graphics – HyperLynx Design kits
Recommended preliminary knowledge for completing the subject
Knowledge type competencies
(azon előzetes ismeretek összessége, amelyek megléte nem kötelező, de a tantárgy eredményes teljesítését nagyban elősegíti)
Electronics
Skill type competencies
(azon előzetes képességek és készségek összessége, amelyek megléte nem kötelező, de a tantárgy eredményes teljesítését nagyban elősegíti)
nincs
Recommended (non-compulsory) preliminary competencies
(azon ajánlott (nem kötelező) előzetesen megszerzendő kompetenciák összessége, amelyek jelentősen hozzájárulnak a tantárgy eredményes teljesítéséhez)
Electronics
General rules
Requirements:
a. During the term: one mid-term test in the 8th week of the semester
Requirement for granting the signature: >= 2 (satisfactory).
The signature is valid for the next semester, too.
b. In the exam period:
Way of examination: written and oral
c. Exam before the examination period:
Possible if the midterm grade >= 4
Additional possibilities:
One mid-term
test.
If a
student fails to turn up at mid-term test, it can be repeated during the term.
Only one laboratory practice can be repeated during the repeat period.
Assessment methods
In-term assessments
No detailed assessments provided.
Weight of in-term assessments
No weights provided.
Exam-period assessments
No detailed assessments provided.
Weight of exam elements
No weights provided.
Grade calculation
No grade thresholds provided.
Attendance requirements
No attendance requirements provided.
Rules for retake and resubmission
Not provided.
Short description
Not provided.
Detailed description
Not provided.
Recommended courses
Successfully fulfill the requirements and get the credit of the followings courses is mandatory:
BMEVIEEMA04
Fundamentals of Smart Systems
Workload to complete the subject
No workload breakdown provided.
Validity of subject requirements
Requirements valid from:
—
Requirements valid until:
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Curriculum placement
No curriculum placements recorded for this subject version.