K-INFO
HU
EN
Login

Circuit Environment

Áramköri környezet kialakítása
A tantárgyleírás hatályossága
Hatályosság kezdete:
2026. March 21.
Hatályosság vége:
Subject name (Hungarian, English)
Áramköri környezet kialakítása
Circuit Environment
Subject code BMEVIEEMA06
Subject type
Training Level
Course types and hours (weekly/semester)
Course type lecture tutorial laboratory
hours (weekly) 2 1 0
type (linked/independent) derived course
Assessment type vizsga
Credits 4
Subject coordinator
DR. Takács Gábor
position: egyetemi docens
Responsible department
Elektronikus Eszközök Tanszéke
Faculty Villamosmérnöki és Informatikai Kar
Subject website
Primary curriculum type
Direct prerequisites – Strong prerequisite none
Direct prerequisites – Weak prerequisite none
Direct prerequisites – Parallel prerequisite none
Direct prerequisites – Milestone prerequisite none
Direct prerequisites – Exclusion none

Objectives

Programme
Syllabus of the lectures
1. The phenomena of circuit environment, borders of the circuit environment, the design steps and implementation issues of SiP, SoP, MCM, 3D stacked ICs devices, TSV.
2. Modern packaging solutions. Fann-ot, WLP, intermediate enclosures with buried silicon layers (EMIBB). Relationship of IC design and enclosure from the design perspective.
3. Investigation of parasitic effects of packaging on the basis of Radio Frequency, thermal and other physical influences: IBIS model, Delphi model, 2R model
4. Development of circuit environment influenced by thermal effects. Active and passive cooling methods, build-up and characterization of microscale cooling devices.
5. Thermal analysis of equipments working in harsh environment (rack drawers, IoT devices in harsh environment, etc.)
6. Thermal transient testing methodology, multi-domain characterization of LED devices, characterization of thermal interface materials (TIM)
7. Introduction of a whole process development flow: the basic steps of the development, test methods, management issues. Reliability investigations, the effects of the ambient to the operation of the circuit.
8. Design flow of electrical equipment from the specification to the realization. Top-down and bottom-up methodology applied in the development flow of the circuit environment (PCW, connections, enclosures, etc.)
9. Specification and documentation issues of the circuit environment.
10. Introduction to signal integrity: plane capacitance, losses, delays, skin effect and proximity effect, wave impedance and passive devices in real parasitic elements.
11. Reflections, terminations of transmission lines: under and overdriven lines, series and parallel R, RC terminations, Thevenin termination, junction
12. Case study: pre-layout signal integrity simulation
13. Cross-talk, differential and common mode signals and impedances, signal propagation
14. Thermal management with industrial CAD tools (Mentor Graphics© FloTHERM)

Syllabus of the laboratory practises:
1. Getting acquainted to a PCW design environment and its build-up
2. Schematic capture
3. The usage and the settings of constraint editor system
4. Design of the layout
5. Thermal simulation
6. pre- and post-layout signal integrity simulations
7. Thermal analysis of packages (Mentor Graphics© FloTHERM® PACK).

The scope of the subject is to get the students acquainted with the development of the packaged intelligent devices operating environment, the design software, the modern simulation tools. Deals with the design, testing, simulation steps and gives practical knowledge on their industrial applications. Introduce the theoretical background of the simulations and physical phenomenon.

Learning outcomes

Ez a tantárgy a KKK rendeletben meghatározott, következő kompetenciák fejlesztését szolgálja:

Knowledge

No learning outcomes recorded.

Skills

No learning outcomes recorded.

Attitudes

No learning outcomes recorded.

Autonomy and responsibility

No learning outcomes recorded.

Oktatási módszertan

2 hours/week lectures and 1 hour/week (computer) laboratory practices including demonstration with practical examples and case studies.

Tanulástámogató anyagok

Online források
-        Clyde F. Coombs: „Printed Circuits Handbook, 6th edition”, McGraw-Hill, USA, 2008; -        Eric Bogatin: „Signal Integrity – Simplified”, Prentice Hall, USA, 2004; -       ; Stephen H. Hall, Garrett W. Hall, James A. McCall: „High- Speed Digital; System – A Handbook of Interconnect Theory and Design Practice”, John; Wiley & Sons, Inc. USA, 2000; -        Horward Johnson, Martin; Graham: „High-Speed Digital Design – A Handbook of Black Magic, Prentice; Hall”, New Jersey, USA, 1993; -        Mentor Graphics - Printed; Circuit Board Design Course Laboratory Instruction:  „Pre-Layout; Analysis with HyperLynx”, Politechnika Śląska w Gliwicach, Instytut; Elektroniki, Zakład Podstaw Elektroniki; -        Mentor Graphics – HyperLynx Design kits

Recommended preliminary knowledge for completing the subject

Knowledge type competencies
(azon előzetes ismeretek összessége, amelyek megléte nem kötelező, de a tantárgy eredményes teljesítését nagyban elősegíti)
Electronics
Skill type competencies
(azon előzetes képességek és készségek összessége, amelyek megléte nem kötelező, de a tantárgy eredményes teljesítését nagyban elősegíti)
nincs
Recommended (non-compulsory) preliminary competencies
(azon ajánlott (nem kötelező) előzetesen megszerzendő kompetenciák összessége, amelyek jelentősen hozzájárulnak a tantárgy eredményes teljesítéséhez)
Electronics
General rules
Requirements: a.         During the term: one mid-term test in the 8th week of the semester Requirement for granting the signature: >= 2 (satisfactory). The signature is valid for the next semester, too. b.         In the exam period: Way of examination: written and oral c.         Exam before the examination period: Possible if the midterm grade >= 4 Additional possibilities: One mid-term test. If a student fails to turn up at mid-term test, it can be repeated during the term. Only one laboratory practice can be repeated during the repeat period.
Assessment methods
In-term assessments

No detailed assessments provided.

Weight of in-term assessments

No weights provided.

Exam-period assessments

No detailed assessments provided.

Weight of exam elements

No weights provided.

Grade calculation

No grade thresholds provided.

Attendance requirements

No attendance requirements provided.

Rules for retake and resubmission

Not provided.

Short description

Not provided.

Detailed description

Not provided.

Recommended courses
Successfully fulfill the requirements and get the credit of the followings courses is mandatory: BMEVIEEMA04 Fundamentals of Smart Systems
Workload to complete the subject

No workload breakdown provided.

Validity of subject requirements
Requirements valid from:
Requirements valid until:
Curriculum placement

No curriculum placements recorded for this subject version.