Nanoelectronics and Nanotechnology

LECTURES

1. The manufacturing of electronic systems, physical, chemical and nanotechnology approaches for reviewing and classification of the manufacturing processes.

2. Semiconductor top-down technologies (1): preparation of single crystals. Epitaxial growth, oxide growth, lithography.

3. Semiconductor top-down technologies (2): etching, CVD, diffusion, ion implantation, conductive and insulator layer deposition.

4. Component and module circuit technology. Compound-semiconductor structures technology and applications: III-V and II-VI compound semiconductors, types of direct and indirect band structure, optical properties and their use, production and use of the compound semiconductor multilayers.

5. Quantum valley structures and their practical applications (e.g. LEDs). Application of nanotechnology in the thermal management of classical semiconductor devices.

6. Isotropic and anisotropic etching. Production of three-dimensional structures (cavities, microchannels, membranes, tubes, needles, bridges, console, suspended weight). Technology versions for the bulk and surface micromachining.

7. Application of thin-film technologies for producing passive networks, optical layer structures and displays (screens, etc).

8. Basics of nanotechnology. Nanotubes, nano-wires, special multilayer structures. Creating semiconductor nano-objects. Solid state and nano-mechanical properties of thin films. The allotrope modifications of carbon and their nanotechnology applications. The creation and use of metallic nanostructures.

9. The scale-down results in physical phenomena of electronic devices and circuits, secondary effects (quantum mechanical, thermal ...), and their influence on the characteristics of the electron devices and circuits.

10. Nanoelectronics devices and components (size-reduced MOS transistors, vacuum microelectronics, single-electron circuits, memory cells, spintronics, quantum electronics, carbon nanotube transistors, graphene oxide electronics, thermal-electronic integrated circuits).

11. Special technological processes for the nanometer size systems, the top-down and bottom-up principle, nanolithography, self-adjusting, and self-mounting.

12. Test methods in the nanometer range, surface scanning test devices (AFM, STM, KFM, NSOM).

13. Importance of the simulation, overview of simulation methods in the nanoelectronics.

14. New results of the nanotechnology and the trends by ITRS.

PRACTICES

1. Semiconductor laboratory visit, an overview of all technological equipment.

2. Semiconductors surface conditions. Relationship between the surface potential barrier and the surface charge density. The surface conditions for various doping and different surface state densities.

3. Scale down in microelectronics. Nanoelectronics and micromechanics: numerical consequences.

4. Presentation of scanning probe methods of measurement techniques, practical basics of tunnelling and atomic force microscopy. Evaluation and processing of AFM images (e.g. levelling, artefact filtering, etc.).

5. Presentation of advanced scanning probe methods (EFM, MFM, KFM, SNOM, SCM, lithography etc).

6. Nanostructures production methods: top-down and bottom-up (vapour, liquid phase, solid phase methods, lithography), practical application of nanostructures.

7. Allotropic modifications of the carbon, nanotechnology applications: graphite, diamond, fullerenes, carbon nanotubes, graphene.