Subject » BMEVIETAB01
Electronics Technology
Elektronikai technológia
A tantárgyleírás hatályossága
Hatályosság kezdete:
2026. March 21.
Hatályosság vége:
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| Subject name (Hungarian, English) |
Elektronikai technológia
Electronics Technology
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| Subject code | BMEVIETAB01 | ||||||||||||
| Subject type | — | ||||||||||||
| Training Level | — | ||||||||||||
| Course types and hours (weekly/semester) |
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| Assessment type | félévközi érdemjegy | ||||||||||||
| Credits | 4 | ||||||||||||
| Subject coordinator |
DR. Krammer Olivér
position: egyetemi docens
contact:
krammer.oliver@vik.bme.hu
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| Responsible department |
Elektronikai Technológia Tanszék
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| Faculty | Villamosmérnöki és Informatikai Kar | ||||||||||||
| Subject website | — | ||||||||||||
| Primary curriculum type | — | ||||||||||||
| Direct prerequisites – Strong prerequisite | none | ||||||||||||
| Direct prerequisites – Weak prerequisite | none | ||||||||||||
| Direct prerequisites – Parallel prerequisite | none | ||||||||||||
| Direct prerequisites – Milestone prerequisite | none | ||||||||||||
| Direct prerequisites – Exclusion | none |
Objectives
Programme
Topics of lectures:
1. Introduction - the purpose of the subject, topics. Classification of electronic components, substrates, assemblies, and brief description of electronic materials.
2. Design and construction of electronic devices, device development, technical specifications, basics of mechanical, thermal, EMC (electromagnetic compatibility) design; design for manufacturing.
3. Through-hole and surface-mounted component structures, properties, classification, storage methods, surface-mounted active components and integrated circuit packages, chip size packages and wafer-level package assembly.
4. Soldering components, creating soldered joints, manual soldering process and tools, wave soldering technology steps, reflow soldering technology steps, and the thermal profile of automated soldering technologies.
5. Semiconductor chips and module circuits attaching methods and packaging, semiconductor chips mechanical attachment by adhesive bonding and Au-Si eutectic soldering, semiconductor chips electrical connection techniques, wire bonding techniques, flip-chip technology.
6. Single-sided, double-sided, multilayer and special circuit board technologies; subtractive, additive and semi-additive patterning technologies; hole-plating techniques for multilayer, co-laminated boards; high-resolution micro vias boards; sequential layered boards.
7. Ceramic- and polymer-based thick-film technology, insulator-based integrated circuits, materials and steps of thick-film technology, properties and types of screens, tape printing, hybrid IC fabrication technology, shapes and value adjustment of layer resistances, low- and high-temperature co-fired ceramic substrates.
8. Materials for additive electronic manufacturing technologies: metal powders, ceramics, thermoplastic polymers, composites, and biochemicals. Technologies: photo-polymerisation, fused deposition modelling, direct metal deposition by electron beam, laser and plasma arc, direct metal deposition, beam material printing, selective laser melting and sintering, direct laser sintering of metals.
9. Vacuum technology, thin film technology, vacuum systems, vacuum pumps, vacuum evaporation and sputtering technology, direct and indirect electrically heated sources, electron beam heated evaporator sources, and thin-film integrated circuits.
10. Electronic quality assurance, the concept of quality, the basics of quality assurance techniques, in-line inspection equipment, qualification criteria for assembled circuits, and mechanical, thermal and electrical validation of electronic devices.
11. Reliability theory, causes and types of failure of electronic assemblies and devices, reliability functions, calculation of reliability characteristics. Analysis of failure modes, motivation, place and role of testing and failure analysis in electronics manufacturing and quality assurance.
12. Integrated circuit and device level thermal management, effects of heat and temperature changes on electronic assemblies and devices, heat energy transfer, thermal interfaces in electronic assemblies; heat sinks, direct and indirect liquid cooling, phase change cooling; thermal design fundamentals; thermal modelling fundamentals.
13. Invited industry speaker
14. Outlook lecture, Industry 4.0 in electronics manufacturing technologies, smart manufacturing, smart factory, industrial IoT (Internet of Things), basics of machine learning methods related to electronics manufacturing, machine-to-machine interfaces in electronics manufacturing; extended HMI (human-machine interface) tools for control and optimisation of machines on the shop floor.
Topics of lab practices:
1. Production of printed wiring boards using subtractive technology, drilling, drilling parameters, photolithography, tin electroplating, copper etching, and solder mask preparation.
2. Electronics circuit assembly by hand soldering; familiarisation with hand soldering tools, hand soldering of through-hole and large-size surface-mounted components (e.g. 1206 size code resistors) to printed wiring board, optical microscopy analysis of the completed joints.
3. Electronics circuit assembly using surface mount technology, reflow soldering, learning the steps of reflow soldering technology, manual stencil printing, inserting components using a manual insertion arm, creating joints in a reflow oven, and inspecting joints using an optical microscope.
4. Computer-aided design of experiments, systematic design of technological experiments, mapping of parameter spaces, determining relevant parameters, design of experiments, visualisation and evaluation of experimental results.
5. Design of printed wiring board, familiarisation with components of computer-aided design systems, creating schematic circuit diagram, design of component drawings, wiring of the circuit substrate, generating production files (Gerber).
6. Prototyping, 3D design basics of assembled circuits and enclosures, the structure of 3D design systems, design basics: creating sketches, creating 3D shapes from sketches, rotation, extrusion, logical operations with bodies, exporting designs - 3D file formats.
7. Thermal simulation of assembled and enclosed circuits; testing temperature distributions on a loaded high-power component; testing temperature distributions on a mounted module circuit as a function of design topology and load parameters.
The primary objective of the Electronics Technology course is to provide students with the fundamentals and theoretical and practical knowledge of the design of electronic circuits and systems, the verification of the design and the validation of the designed circuits and devices. The objective of the course is to provide an overview of the structure, design, manufacturing and assembly technology of electronic components and devices, circuit modules and electronic appliances, and trends in the development of the field.
The course covers the knowledge of electronics technology, microelectronics, circuit design, assembly technology and electronic device development that is necessary for all electrical engineers to have a basic understanding of integrated circuits, the design of electronic components and systems, and to interact with industry specialists and researchers in this field.
Learning outcomes
Ez a tantárgy a KKK rendeletben meghatározott, következő kompetenciák fejlesztését szolgálja:
Knowledge
No learning outcomes recorded.
Skills
No learning outcomes recorded.
Attitudes
No learning outcomes recorded.
Autonomy and responsibility
No learning outcomes recorded.
Oktatási módszertan
Lectures and lab practices
Tanulástámogató anyagok
Online források
Harsányi Gábor: Elektronikai technológia, BME Viking Zrt., VI202-010, Budapest, 2011; B. Illés, O. Krammer, A. Géczy: Reflow Soldering: Apparatus and Heat Transfer Processes, Elsevier, Amsterdam, Hollandia, 2020, ISBN: 9780128185056; Pinkola János (szerk.): Elektronikai Technológia Laboratórium, Műegyetemi kiadó, 55082, Budapest, 2007
Recommended preliminary knowledge for completing the subject
Knowledge type competencies
(azon előzetes ismeretek összessége, amelyek megléte nem kötelező, de a tantárgy eredményes teljesítését nagyban elősegíti)
Materials in Electronics
Skill type competencies
(azon előzetes képességek és készségek összessége, amelyek megléte nem kötelező, de a tantárgy eredményes teljesítését nagyban elősegíti)
nincs
Recommended (non-compulsory) preliminary competencies
(azon ajánlott (nem kötelező) előzetesen megszerzendő kompetenciák összessége, amelyek jelentősen hozzájárulnak a tantárgy eredményes teljesítéséhez)
Materials in Electronics
General rules
Requirements:
Period for lectures, seminars and practical work:
Participation in all 7 laboratory exercises and successful fulfillment. All laboratory exercises begin with a 15-minute test for checking successful preparation. A minimum of satisfactory level is expected. Two 60-minute mid-terms have to be fulfilled on a minimum of satisfactory level.
Examination period: no requirement.
Additional possibilities:
If failed, the 15-minute test can only be retaken with the complete laboratory exercise. No more than 2 laboratory exercises can be retaken during the semester.
Retaking the mid-terms for any reason (fail, intention to improve) is only possible one time. Re-retake is only allowed if the previous mid-terms are generally unsuccessful (less than one-third could pass).
Assessment methods
In-term assessments
No detailed assessments provided.
Weight of in-term assessments
No weights provided.
Exam-period assessments
No detailed assessments provided.
Weight of exam elements
No weights provided.
Grade calculation
No grade thresholds provided.
Attendance requirements
No attendance requirements provided.
Rules for retake and resubmission
Not provided.
Short description
Not provided.
Detailed description
IMSc program:
For the lab practices in the subject, students participating in the programme are placed in separate groups. For the students participating in the programme, some lab practices will be supervised by the most experienced colleague in the field (who is/has been doing research in the field), who will introduce the students to the current research topics and recent results in the field, in addition to the basic laboratory material.
IMSc points:
IMSc scoring is based on the 2 extra tasks given in the summative assessment for the subject. The percentage of extra tasks in the summative assessment is 25%. Extra IMSc points can be obtained above a 75% pass mark in the summative assessments. The maximum IMSc score for the subject is 20 (max.
IMSc points are also available to students not participating in the programme.
Recommended courses
Not provided.
Workload to complete the subject
No workload breakdown provided.
Validity of subject requirements
Requirements valid from:
—
Requirements valid until:
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Curriculum placement
No curriculum placements recorded for this subject version.